TCS3413 View Datasheet(PDF) - austriamicrosystems AG
Part Name
Description
MFG CO.
'TCS3413' PDF : 56 Pages View PDF
TCS3404, TCS3414 − Packaging Mechanical Data
Packaging Mechanical Data
Figure 53:
Package CS - Six-Lead Chipscale Packaging Configuration
TOP VIEW
2095
1565
+ 10
1875
END VIEW
685 + 45
350
+ 10
PHOTODIODE ARRAY
405 + 20
6 y 160 + 30
BOTTOM VIEW
CL of Photodiode
Array Area
463 + 30
CL of Solder Bumps
128 Nominal
6 y j 300 + 30
RoHS
Green
950
Nominal
CL of Solder Bumps and
Photodiode Array Area
438 + 30
610 Nominal
Note(s):
1. All linear dimensions are in micrometers. Dimension tolerance is ±25μm unless otherwise noted.
2. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
3. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
4. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2015-Nov-11
Page 45
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