TCS3413 View Datasheet(PDF) - austriamicrosystems AG
Part Name
Description
MFG CO.
'TCS3413' PDF : 56 Pages View PDF
TCS3404, TCS3414 − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package
molding compound. To ensure the package molding
compound contains the smallest amount of absorbed moisture
possible, each device is dry-baked prior to being packed for
shipping. Devices are packed in a sealed aluminized envelope
with silica gel to protect them from ambient moisture during
shipping, handling, and storage before use.
CS Package
The CS package has been assigned a moisture sensitivity level
of MSL 2 and the devices should be stored under the following
conditions:
• Temperature Range: 5°C to 50°C
• Relative Humidity: 60% maximum
• Floor Life: 1 year out of bag at ambient < 30°C / 60% RH
Rebaking will be required if the aluminized envelope has been
open for more than 1 year. If rebaking is required, it should be
done at 50°C for 12 hours.
FN Package
The FN package has been assigned a moisture sensitivity level
of MSL 3 and the devices should be stored under the following
conditions:
• Temperature Range: 5°C to 50°C
• Relative Humidity: 60% maximum
• Total Time: 12 months from the date code on the
aluminized envelope - if unopened
• Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 12 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking
is required, it should be done at 50°C for 12 hours.
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ams Datasheet
[v1-00] 2015-Nov-11
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