TCS3413 View Datasheet(PDF) - austriamicrosystems AG
Part Name
Description
MFG CO.
'TCS3413' PDF : 56 Pages View PDF
TCS3404, TCS3414 − Manufacturing Information
Manufacturing Information
Figure 57:
Solder Reflow Profile
The CS and FN packages have been tested and has
demonstrated an ability to be reflow soldered to a PCB
substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217°C (T1)
Time above 230°C (T2)
Time above Tpeak -10°C (T3)
Peak temperature in reflow
Temperature gradient in cooling
Reference
tsoak
t1
t2
t3
Tpeak
TCS3404/14
2.5°C/s
2 to 3 minutes
Max 60s
Max 50s
Max 10s
260° C (-0°C/5°C)
Max -5°C/s
Figure 58:
Solder Reflow Profile Graph
Tpeak
T3
T2
T1
Not to scale — for reference only
Time (s)ec)
tsoak
Note(s):
1. Not to scale - for reference only.
ams Datasheet
[v1-00] 2015-Nov-11
t3
t2
t1
Page 49
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