TCS3413 View Datasheet(PDF) - austriamicrosystems AG
Part Name
Description
MFG CO.
'TCS3413' PDF : 56 Pages View PDF
TCS3404, TCS3414 − Packaging Mechanical Data
Figure 54:
Package FN - Dual Flat No-Lead Packaging Configuration
PACKAGE FN
TOP VIEW
PIN 1
1565
+ 10
350 + 10
3000
+ 100
SCL 1
SYNC 2
SDA 3
Dual Flat No-Lead
PIN OUT
TOP
VIEW
6 GND
5 Vdd
4 INT
END VIEW
650 + 50
3000
+ 100
PHOTODIODE ARRAY
295
Nominal
BOTTOM VIEW
CL of Photodiode
Array Area
(Note )
CL of Solder Contacts
128 Nominal
SIDE VIEW
203 + 8
950
300
+ 50
PIN 1
CL of Solder Contacts and
Photodiode Array Area (Note )
RoHS
950 + 150
Green
Note(s):
1. All linear dimensions are in micrometers. Dimension tolerance is ±20μm unless otherwise noted.
2. The die is centered within the package within a tolerance of ±3 mils.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Page 46
Document Feedback
ams Datasheet
[v1-00] 2015-Nov-11
Share Link: 
