TGA2509 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA2509' PDF : 7 Pages View PDF
Mechanical Characteristics
TGA2509
3.200 (0.126)
3.105 (0.122)
2
0.333 (0.013)
1
0.095 (0.004)
0.000 (0.000)
6
3 0.482 (0.019)
5
4
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond pad #1
Bond pad #2
Bond pad #3
Bond pad #4
Bond pad #5
Bond pad #6
(RF In)
(Vg1)
(RF Out)
(Vd)
(Vg2)
(VC)
0.100 x 0.150 (0.004 x 0.006)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.150 (0.004 x 0.006)
0.250 x 0.100 (0.010 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
6
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -
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