TGA2509 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA2509' PDF : 7 Pages View PDF
Recommended Assembly Diagram
TGA2509
Bias Procedures:
Vc bias connection is optional, but the
100pF cap always needs to be
connected.
For biasing without AGC control:
1. Apply -1.2V to Vg1, and -1.2V to
Vg2.
2. Apply +12V to Vd.
4. Adjust Vg1 to attain 580 mA drain
current (Id)
4. Adjust Vg2 to attain 1080 mA total
drain current (Id).
For biasing with AGC control:
1. Apply -1.2V to Vg1 and -1.2V to Vg2
2. Apply +12V to Vd
3. Apply +2.6V to Vc
4. Adjust Vg1 to attain 580 mA drain
current (Id)
5. Adjust Vg2 to attain 1080 mA total
drain current (Id).
6. Adjust Vc as needed to control gain
level.
Vg1
1 uF
100pF
RF IN
RF OUT
100pF 100pF 100pF
1 uF
1 uF
Vc
Vg2
Vd
To ensure low frequency stability, use 1uF surface mount (not leaded)
capacitors (on the Vd, Vg1, and Vg2 nodes) that are located close to the MMIC.
Contact TriQuint Semiconductor Applications Engineering for more details.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
7
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -
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