5962-9750701HXC View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'5962-9750701HXC' PDF : 44 Pages View PDF
18
16
14
Y = 0.0796X + 1.17
12
10
RISE TIME
8
6
Y = 0.0467X + 0.55
4
FALL TIME
2
0
0 20 40 60 80 100 120 140 160 180 200
LOAD CAPACITANCE – pF
Figure 33. Typical Output Rise Time (10%–90% VDD) vs.
Load Capacitance (VDD = 3.3 V)
9
8
7
6
Y = 0.0391X + 0.36
5
4
RISE TIME
Y = 0.0305X + 0.24
3
FALL TIME
2
1
0
0 20 40 60 80 100 120 140 160 180 200
LOAD CAPACITANCE – pF
Figure 34. Typical Output Rise Time (0.8 V –2.0 V) vs.
Load Capacitance (VDD = 3.3 V)
5
4.5
4
Y = 0.0329X - 1.65
3
2
1
NOMINAL
–0.7
–1
25
50
75
100
125
150 175
200
LOAD CAPACITANCE – pF
Figure 35. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (VDD = 3.3 V)
AD14060/AD14060L
AD14060/AD14060L ASSEMBLY
RECOMMENDATIONS
SOCKET INFORMATION
Standard sockets and carriers are available for the AD14060/
AD14060L, if needed. Socket part number IC53-3084-262 and
carrier part number ICC-308-1 are available from Yamaichi
Electronics.
Trim and Form
The AD14060/AD14060L will be shipped as shown on the final
page of the data sheet with untrimmed and unformed leads and
with the nonconductive tie bar in place. This avoids disturbance of
lead spacing and coplanarity prior to assembly. Optimally, the
leads should be trimmed, formed and solder-dipped just prior to
placement on the board.
Trim/Form can be accomplished with a Universal Trim/Form,
Customer-Designed Trim/Form, or with the Analog Devices’
Developed Tooling described below.
A trim/form tool specific to the AD14060/AD14060L has been
developed and is available for use by all parties at:
Tintronics Industries
2122-A Metro Circle
Huntsville, AL 35801
205-650-0220
Contact Person: Tom Rice
The package outline and dimensions resulting from this tool are
shown below. (Alternatively, the package can also be trimmed/
formed for cavity-down placement.)
0.170
(4.318)
2.110 (53.59)
2.210 ±0.010 (56.134 ±0.254)
0.016 MIN
0 TO 10 MILS
DETAIL "A"
0° TO 8°
REV. A
–39–
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