LTC3717-1 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTC3717-1
Linear Technology
'LTC3717-1' PDF : 20 Pages View PDF
PACKAGE DESCRIPTIO
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
5.35 ±0.05
4.20 ±0.05
3.45 ±0.05
(4 SIDES)
0.57 ±0.05
LTC3717-1
0.23 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
5.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
PACKAGE OUTLINE
0.75 ± 0.05
0.00 – 0.05
3.45 ± 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31 32
0.40 ± 0.10
1
2
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
0.23 ± 0.05
0.50 BSC
(UH) QFN 0102
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
sn37171 37171fs
19
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