M24256-BF View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

M24256-BF

256-Kbit serial I²C bus EEPROM

STMicroelectronics 

Prev 31 32 33 34 35 36 37 38 39 40 Next

M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF

9

Package information

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

9.1

UFDFPN8 (DFN8) package information

Figure 15. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch

dual flat package, no lead - package outline



3LQ,'PDUNLQJ

Ğ

ď

>ϭ

>ϯ

WŝŶϭ



Ϯ

<

>



Ϯ

ĞĞĞ

ϭ

=:B0(H9

1. Drawing is not to scale.

2.

The

(not

central pad

connected)

(the area E2 by D2 in the

in the end application.

above

illustration)

must

be

either

connected

to

VSS

or

left

floating

Table 19. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package,

no lead - package mechanical data

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

A

0.450

0.550

0.600

0.0177

0.0217

0.0236

A1

0.000

0.020

0.050

0.0000

0.0008

0.0020

b

0.200

0.250

0.300

0.0079

0.0098

0.0118

D

1.900

2.000

2.100

0.0748

0.0787

0.0827

D2

1.200

-

1.600

0.0472

-

0.0630

E

2.900

3.000

3.100

0.1142

0.1181

0.1220

E2

1.200

-

1.600

0.0472

-

0.0630

e

-

0.500

-

-

0.0197

-

K

0.300

-

-

0.0118

-

-

DS1766 Rev 34

33/47

46

Share Link: