M24256-BF View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

M24256-BF

256-Kbit serial I²C bus EEPROM

STMicroelectronics 

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Package information

Table 22. WLCSP (CS)- 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip scale

package mechanical data (continued)

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

G

-

0.245

-

H

-

0.245

-

aaa

-

0.110

-

bbb

-

0.110

-

ccc

-

0.110

-

ddd

-

0.060

-

eee

-

0.060

-

-

0.0096

-

-

0.0096

-

-

0.0043

-

-

0.0043

-

-

0.0043

-

-

0.0024

-

-

0.0024

-

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Figure 20. WLCSP (CS) - 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip

scale package recommended footprint

PP

PP

PP

1. Dimensions are expressed in millimeters.

PP

EXPSV[¹PP

&JB)3B9

DS1766 Rev 34

39/47

46

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