M24256-BF View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

M24256-BF

256-Kbit serial I²C bus EEPROM

STMicroelectronics 

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Package information

M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF

9.4

WLCSP8 (CS) package information

Figure 19. WLCSP (CS) - 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip

scale package outline

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1. Drawing is not to scale.

Table 22. WLCSP (CS)- 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip scale

package mechanical data

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

A

0.500

0.540

0.580

0.0197

0.0213

0.0228

A1

-

0.190

-

-

0.0075

-

A2

-

0.350

-

b(2)

-

0.270

-

-

0.0138

-

-

0.0106

-

D

-

1.289

1.309

-

0.0507

0.0515

E

-

1.376

1.396

-

0.0542

0.0550

e

-

0.800

-

-

0.0315

-

e1

-

0.693

-

-

0.0273

-

e2

-

0.400

-

-

0.0157

-

e3

-

0.400

-

-

0.0157

-

F

-

0.342

-

-

0.0135

-

38/47

DS1766 Rev 34

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