M24256-BF View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M24256-BF' PDF : 47 Pages View PDF
Package information
M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF
9.5
WLCSP8 (CU) package information
Figure 21. WLCSP (CU)- 8 balls, 1.289x1.1.309 mm, 0.4 mm pitch, with BSC, wafer
level chip scale package outline
DDD
;
'
;
<
'HWDLO$
H
H
*
2ULHQWDWLRQUHIHUHQFH
7239,(:
(
DDD
;
$
E
$
$
$
6,'(9,(:
('&%$
H H
)
2ULHQWDWLRQUHIHUHQFH
%277209,(:
EEE =
$
E
FFF 0 = ; <
GGG 0 =
'HWDLO$
5RWDWHG
=
6HDWLQJSODQH
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
$=B37IB:/&63B0(B9
Table 23. WLCSP (CU)- 8 balls, 1.289x1.1.309 mm, 0.4 mm pitch, with BSC, wafer level
chip scale mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.255
0.295
0.335
0.0100
0.0116
0.0132
A1
-
0.095
-
-
0.0037
-
A2
-
0.175
-
-
0.0069
-
A3
-
0.025
-
-
0.0010
-
b
-
0.185
-
-
0.0073
-
D
-
1.289
1.309
-
0.0507
0.0515
E
-
1.376
1.396
-
0.0542
0.0550
e
-
0.400
-
-
0.0157
-
e1
-
0.800
-
-
0.0315
-
e2
-
0.346
-
-
0.0136
-
e3
-
0.693
-
-
0.0273
-
F
-
0.342
-
-
0.0135
-
40/47
DS1766 Rev 34
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