MPC8349VVAGFB View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
MPC8349VVAGFB
Freescale Semiconductor
'MPC8349VVAGFB' PDF : 87 Pages View PDF
Thermal
Table 62. Suggested PLL Configurations (continued)
RCWL
400 MHz Device
533 MHz Device
667 MHz Device
Ref
No.1 SPMF
CORE
PLL
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
306 0011 0000110
—
—
66
200
600
405 0100 0000101
—
—
66
266
667
504 0101 0000100
—
—
66
333
667
1 The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
2 The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
20 Thermal
This section describes the thermal specifications of the MPC8349EA.
20.1 Thermal Characteristics
Table 63 provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8349EA.
Table 63. Package Thermal Characteristics for TBGA
Characteristic
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Symbol
RθJA
RθJMA
RθJMA
RθJMA
RθJMA
RθJMA
RθJB
RθJC
Value
14
11
11
8
9
7
3.8
1.7
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
5
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
74
Freescale Semiconductor
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