MPC8349VVAGFB View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
MPC8349VVAGFB
Freescale Semiconductor
'MPC8349VVAGFB' PDF : 87 Pages View PDF
Thermal
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 64 shows heat sink thermal resistance for TBGA of the MPC8349EA.
Table 64. Heat Sink and Thermal Resistance of MPC8349EA (TBGA)
Heat Sink Assuming Thermal Grease
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
Air Flow
Natural convection
1 m/s
2 m/s
Natural convection
1 m/s
2 m/s
Natural convection
1 m/s
2 m/s
Natural convection
1 m/s
2 m/s
1 m/s
35 × 35 mm TBGA
Thermal Resistance
10
6.5
5.6
8.4
4.7
4
5.7
3.5
2.7
6.7
4.1
2.8
3.1
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
77
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