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MPC8541CPXAJD View Datasheet(PDF) - Freescale Semiconductor

Part Name
Description
MFG CO.
'MPC8541CPXAJD' PDF : 84 Pages View PDF
16 Thermal
This section describes the thermal specifications of the MPC8541E.
Thermal
16.1 Thermal Characteristics
Table 49 provides the package thermal characteristics for the MPC8541E.
Table 49. Package Thermal Characteristics
Characteristic
Symbol Value
Unit
Notes
Junction-to-ambient Natural Convection on four layer board (2s2p)
RθJMA
17
°C/W
1, 2
Junction-to-ambient (@200 ft/min or 1.0 m/s) on four layer board (2s2p)
RθJMA
14
°C/W
1, 2
Junction-to-ambient (@400 ft/min or 2.0 m/s) on four layer board (2s2p)
RθJMA
13
°C/W
1, 2
Junction-to-board thermal
RθJB
10
°C/W
3
Junction-to-case thermal
RθJC
0.96
°C/W
4
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance
2. Per JEDEC JESD51–6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). Cold plate temperature is used for case temperature; measured value includes the thermal resistance of the
interface layer.
16.2 Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in Figure 42. The heat sink should be attached to the printed-circuit
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
67
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