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MPC8541CPXAJD View Datasheet(PDF) - Freescale Semiconductor

Part Name
Description
MFG CO.
'MPC8541CPXAJD' PDF : 84 Pages View PDF
Thermal
Heat Sink
Heat Sink
Clip
Thermal Interface Material
Lid
Die
FC-PBGA Package
Printed-Circuit Board
Figure 42. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the MPC8541E.
There are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
408-749-7601
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
818-842-7277
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
408-436-8770
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
800-522-6752
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
603-635-5102
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
68
Freescale Semiconductor
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