MPC8541CPXAJD View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
MPC8541CPXAJD
Freescale Semiconductor
'MPC8541CPXAJD' PDF : 84 Pages View PDF
Thermal
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,
and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that allows the
MPC8541E to function in various environments.
16.2.1 Recommended Thermal Model
For system thermal modeling, the MPC8541E thermal model is shown in Figure 44. Five cuboids are used
to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block
29x29x1.6 mm with the conductivity adjusted accordingly. The die is modeled as 8.7 x 9.3 mm at a
thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed resistance between the die and
substrate assuming a conductivity of 4.4 W/m•K in the thickness dimension of 0.07 mm. The lid attach
adhesive is also modeled as a collapsed resistance with dimensions of 8.7 x 9.3 x 0.05 mm and the
conductivity of 1.07 W/m•K. The nickel plated copper lid is modeled as 11 x 11 x 1 mm.
Conductivity
Value
Unit
Lid
(11 × 11 × 1 mm)
kx
360
ky
360
kz
360
Lid Adhesive—Collapsed resistance
(8.7 × 9.3 × 0.05 mm)
kz
1.07
Die
(8.7 × 9.3 × 0.75 mm)
W/(m × K)
Lid
Adhesive
Bump/underfill
z
Die
Substrate and solder balls
Side View of Model (Not to Scale)
x
Bump/Underfill—Collapsed resistance
(8.7 × 9.3 × 0.07 mm)
kz
4.4
Substrate and Solder Balls
(25 × 25 × 1.6 mm)
kx
14.2
ky
14.2
kz
1.2
Substrate
Heat Source
y
Top View of Model (Not to Scale)
Figure 43. MPC8541E Thermal Model
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
69
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