64Mb: x32
DDR SDRAM
ABSOLUTE MAXIMUM RATINGS*
Voltage on VDD Supply
Relative to VSS ...................................... -1V to +3.6V
Voltage on VDDQ Supply
Relative to VSS ...................................... -1V to +3.6V
Voltage on VREF and Inputs
Relative to VSS ...................................... -1V to +3.6V
Voltage on I/O Pins
Relative to VSS ........................ -0.5V to VDDQ +0.5V
Operating Temperature, TA (ambient) .. 0°C to +70°C
Storage Temperature (plastic) ........... -55°C to +150°C
Power Dissipation ................................................... 1W
Short Circuit Output Current ............................ 50mA
*Stresses greater than those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only, and functional
operation of the device at these or any other conditions
above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maxi-
mum rating conditions for extended periods may affect
reliability.
DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS
(Notes: 1-5, 16; notes appear on pages 47-50) (0°C ≤ TA ≤ +70°C;)
PARAMETER/CONDITION
SYMBOL
Supply Voltage, Part Type 2.5V/2.65V
VDD
I/O Supply Voltage, Part Type 2.5V/2.65V
VDDQ
I/O Reference Voltage
VREF
I/O Termination Voltage (system)
VTT
Input High (Logic 1) Voltage
VIH(DC)
Input Low (Logic 0) Voltage
VIL(DC)
Clock Input Voltage Level; CK and CK#
VIN
Clock Input Differential Voltage; CK and CK#
VID
Clock Input Crossing Point Voltage; CK and CK#
VIX
Input Leakage Current:
Any input 0V ≤ VIN ≤ VDD
II
(All other pins not under test = 0V)
Output Leakage Current:
IOZ
(DQs are disabled; 0V ≤ VOUT ≤ VDDQ)
Output Levels: Impedance Match
High Current (VOUT = VDDQ-0.373V, minimum VREF, minimum VTT) IOH
Low Current (VOUT = 0.373V, maximum VREF,maximum VTT)
IOL
Output Levels: Reduced drive option
High Current (VOUT = VDDQ-0.763V, minimum VREF, minimum VTT) IOHR
Low Current (VOUT = 0.763V, maximum VREF,maximum VTT)
IOLR
MIN
2.4/2.55
2.4/2.55
0.49 x VDDQ
VREF - 0.04
VREF + 0.15
-0.3
-0.3
0.36
1.2
-2
-5
-4
4
-9
9
MAX
2.6/2.75
2.6/2.75
0.51 x VDDQ
VREF + 0.04
VDD + 0.3
VREF - 0.15
VDDQ + 0.3
VDDQ + 0.6
1.4
2
5
–
–
–
–
UNITS NOTES
V 42
V 42
V 6,44
V 7,44
V 28
V 28
V
V
8
V 9,43
µA
µA
mA 37, 39
mA
mA 38, 39
mA
AC INPUT OPERATING CONDITIONS
(Notes: 1-5, 14, 16; notes appear on pages 47-50) (0°C ≤ TA ≤ +70°C;)
PARAMETER/CONDITION
Input High (Logic 1) Voltage; DQ
Input Low (Logic 0) Voltage; DQ
Clock Input Differential Voltage; CK and CK#
Clock Input Crossing Point Voltage; CK and CK#
SYMBOL
MIN
VIH(AC) VREF + 0.310
VIL(AC)
–
VID(AC)
0.7
VIX(AC) 0.5 x VDDQ-0.2
MAX
UNITS
–
V
VREF - 0.310
V
VDDQ + 0.6
V
0.5 x VDDQ+0.2 V
NOTES
28, 39
28, 39
8
9
64Mb: x32 DDR SDRAM
2M32DDR-07.p65 – Rev. 12/01
41
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.