MT55L256L36PF-7.5 View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT55L256L36PF-7.5' PDF : 30 Pages View PDF
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
FBGA PIN DESCRIPTIONS (CONTINUED)
x18
x32/x36 SYMBOL TYPE
DESCRIPTION
4C, 4N, 5C, 4C, 4N, 5C,
VSS
5D, 5E, 5F, 5G, 5D, 5E, 5F, 5G,
5H, 5J, 5K, 5L, 5H, 5J, 5K, 5L,
5M, 6C, 6D, 5M, 6C, 6D,
6E, 6F, 6G, 6H, 6E, 6F, 6G, 6H,
6J, 6K, 6L, 6M, 6J, 6K, 6L, 6M,
7C, 7D, 7E, 7F, 7C, 7D, 7E, 7F,
7G, 7H, 7J, 7K, 7G, 7H, 7J, 7K,
7L, 7M, 8C, 8N 7L, 7M, 8C, 8N
Supply Ground: GND.
5P, 7P, 5R, 7R 5P, 7P, 5R, 7R DNU
– Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
1A, 1B, 1C, 1D, 1A, 1B, 1P,
NC
1E, 1F, 1G, 2C, 2N, 2P,
1P, 2C, 2J, 2K, 2R, 3H, 5N,
2L, 2M, 2N, 6N, 9B, 9H,
2P, 2R, 3H, 4B, 10C, 10H, 10N,
5A, 5N, 6N, 11A, 11B, 11P
9B, 9H, 10C,
10D, 10E, 10F,
10G, 10H, 10N,
11B, 11J, 11K,
11L, 11M,
11N, 11P
– No Connect: These signals are not internally connected and may be
connected to ground to improve package heat dissipation.
Pin 9B is reserved for address pin expansion; 16MB.
NF
— No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
11
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.
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