MT55L256L36PF-7.5 View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT55L256L36PF-7.5' PDF : 30 Pages View PDF
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
BGA PIN DESCRIPTIONS (continued)
x18
3D, 3E, 3F,
3H, 3K, 3L,
3M, 3N, 3P,
5D, 5E, 5F,
5G, 5H, 5K,
5M, 5N, 5P
2U, 3U, 4U,
5U
1B, 1C, 1E,
1G, 1K, 1P,
1R, 1T, 2D,
2F, 2H, 2L,
2N, 3J, 4D,
4L, 4T, 5J,
6E, 6G, 6K,
6M, 6P, 6U,
7B, 7C, 7D,
7H, 7L, 7N,
7R
x32/x36 SYMBOL TYPE
DESCRIPTION
3D, 3E, 3F,
3H, 3K, 3M,
3N, 3P, 5D,
5E, 5F, 5H,
5K, 5M, 5N,
5P
VSS Supply Ground: GND.
2U, 3U, 4U,
5U
DNU
– Do Not Use: These signals may either be unconnected or wired
to GND to improve package heat dissipation.
1B, 1C, 1R,
NC
1T, 2T, 3J,
4D, 4L, 5J,
6T, 6U, 7B,
7C, 7R
– No Connect: These signals are not internally connected and
may be connected to ground to improve package heat
dissipation.
NF
— No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.
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