SPC5607BECLLR View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
'SPC5607BECLLR' PDF : 92 Pages View PDF
Electrical characteristics
3.10.3 Start-up/Switch-off timings
Table 26. Start-up time/Switch-off time
Symbol
C
Parameter Conditions1
Min
Value
Typ
TFLARSTEXI CC
T
T
Delay for
—
Flash
module to
exit reset
mode
—
—
TFLALPEXIT CC
T
Delay for
—
Flash
module to
exit
low-power
mode
—
—
TFLAPDEXIT CC
T
Delay for
—
Flash
module to
exit
power-dow
n mode
—
—
TFLALPENTR CC
T
Y
Delay for
—
Flash
module to
enter
low-power
mode
—
—
TFLAPDENT CC
T
RY
Delay for
—
Flash mod-
ule to enter
power-dow
—
—
n mode
1 VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified
Max
125
0.5
30
0.5
1.5
Unit
µs
3.11 Electromagnetic compatibility (EMC) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
3.11.1 Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical application environment and simplified
MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in
particular.
Therefore it is recommended that the user apply EMC software optimization and prequalification tests in relation with the EMC
level requested for the application.
• Software recommendations − The software flowchart must include the management of runaway conditions such as:
— Corrupted program counter
MPC5607B Microcontroller Data Sheet, Rev. 3
40
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
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