LH28F008SC View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'LH28F008SC' PDF : 38 Pages View PDF
8M (1M × 8) Flash Memory
LH28F008SC
Power Dissipation
When designing portable systems, designers must
consider battery power consumption not only during
device operation, but also for data retention during sys-
tem idle time. Flash memory’s nonvolatility increases
usable battery life because data is retained when sys-
tem power is removed.
In addition, deep power-down mode ensures
extremely low power consumption even when system
power is applied. For example, portable computing prod-
ucts and other power sensitive applications that use an
array of devices for solid-state storage can consume
negligible power by lowering RP» to VIL standby or sleep
modes. If access is again needed, the devices can be
read following the tPHQV and tPHWL wake-up cycles re-
quired after RP » is first raised to VIH. See AC Character-
istics - Read Only and Write Operations and Figures 16
and 17 for more information.
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings*
Commercial Operating Temperature
during Read, Block Erase, Byte Write,
and Lock-Bit Configuration ............... 0°C to +70°C1
Temperature under Bias ...................... -10°C to +80°C
StorageTemperature: ......................... 65°C to +125°C
Voltage On Any Pin
(except VCC, VPP and RP ») ................ -2 V to +7.0 V2
VCC Supply Voltage ........................... -2.0 V to +7.0 V2
VPP Update Voltage during Block Erase,
Byte Write,and Lock-Bit
Configuration ............................ -2.0 V to +14.0 V2, 3
RP » Voltage with Respect to GND
during Lock-Bit Configuration
Operations ...............................-2.0 V to +14.0 V2, 3
Output Short Circuit Current .......................... 100 mA4
NOTICE: This datasheet contains information on
products in the design phase of development. Do not
finalize a design with this information. Revised informa-
tion will be published when the product is available.
Veryify with your local SHARP sales office that you have
the latest datasheet before finalizing a design.
*WARNING: Stressing the device beyond the “Abso-
lute Maximum Ratings” may cause permanent damage.
These are stress ratings only. Operation beyond the
“Operating Conditions” is not recommended and ex-
tended exposure beyond the “Operating Conditions” may
affect device reliability.
NOTES:
1. Operating temperature is for commercial product defined by
this specification.
2. All specified voltages are with respect to GND. Minimum DC
voltage is -0.5 V on input/output pins and -0.2 V on VCC and VPP
pins. During transitions, this level may undershoot to -2.0 V for
periods < 20 ns. Maximum DC voltage on input/output pins and
VCC is VCC + 5.0 V which, during transitions, may overshoot to
VCC + 2.0 V for periods < 20 ns.
3. Maximum DC voltage on VPP and RP » may overshoot to
+14.0 V for periods < 20 ns.
4. Output shorted for no more than on second. No more than one
output shorted at a time.
Operating Conditions
Temperature and VCC Operating Conditions
SYMBOL
PARAMETER
MIN.
TA
Operating Temperature
0
VCC1 VCC Supply Voltage (3.3 V ± 0.3 V)
3.0
VCC2 VCC Supply Voltage (5 V ± 5%)
4.75
VCC3 VCC Supply Voltage (5 V ± 10%)
4.50
MAX.
+70
3.6
5.25
5.50
UNIT
°C
V
V
V
TEST CONDITION
Ambient Temperature
21
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