MT48H8M32LFBF-8 View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT48H8M32LFBF-8' PDF : 71 Pages View PDF
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
Package Dimensions
Package Dimensions
Figure 51: 54-Ball VFBGA (8mm x 9mm)
0.65 ±0.05
SEATING
PLANE
0.10 A
A
54X Ø0.45
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.40
SMD BALL PAD.
BALL A9
6.40
3.20
6.40
0.80
TYP
BALL A1 ID
BALL A1
4.50 ±0.05
CL
9.00 ± 0.10
0.80 TYP
SOLDER BALL MATERIAL:
96.5% Sn, 3% Ag, 0.5% Cu
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
MICRON LOGO
TO BE LASED
BALL A1 ID
CL
3.20
4.00 ±0.05
8.00 ±0.10
Notes: 1. All dimensions are in millimeters.
1.00 MAX
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
MT48H16M16LF_2.fm - Rev F 4/07 EN
70
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2006 Micron Technology, Inc. All rights reserved.
Share Link: 
