ST40RA166 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'ST40RA166' PDF : 88 Pages View PDF
ST40RA166
8 Package
Physical properties:
q 27x27mm 372 pin BGA package,
q Typical power consumption <2 W,
q Substrate height: 0.56 mm,
q Total height: 2.33 mm,
q Cover + substrate: 1.73 mm.
Figure 19 is a diagram of the pin disposition on the package.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
V
W
Y
Top view
Pin #1
corner
8 Package
Side view
Figure 19: Package layout (viewed through package)
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